解决方案
 
Solar Cell Chip Lamination EL Detection

 Project description:

Much background interference and low contrast of defect gray level exist in this detection. The AI solution proposed by Dongsheng Intelligent Technology based on Handdle AI deep learning algorithm and AI technology can greatly improve production efficiency and detection accuracy, as well as reduce costs while increasing efficiency for manufacturers.




   Defect types:

Broken gate, electric leakage, black chips, edge absence, cracked chips (including tiny hidden cracks, cross hidden cracks, arc cracks, through-chip cracks, explosion cracks), incomplete solder and short circuit.





                                                                                                      Original picture                                                                                                                                                  Detection picture


  


     AI overall intelligent detection       Standardized software and hardware products + customized development         Intelligent image analysis technology