Project description:
Much background interference and low contrast of defect gray level exist in this detection. The AI solution proposed by Dongsheng Intelligent Technology based on Handdle AI deep learning algorithm and AI technology can greatly improve production efficiency and detection accuracy, as well as reduce costs while increasing efficiency for manufacturers.
Defect types:
Broken gate, electric leakage, black chips, edge absence, cracked chips (including tiny hidden cracks, cross hidden cracks, arc cracks, through-chip cracks, explosion cracks), incomplete solder and short circuit.
Original picture Detection picture
AI overall intelligent detection Standardized software and hardware products + customized development Intelligent image analysis technology
US | 2080 N. Hwy 360,Grand
Prairie, Texas 75050
Business cooperation:sales@dstekai.com
Media cooperation:pr@dstekai.com
Talent recruitment:dshr@dstekai.com