Project description:
With Handdle AI algorithm platform and the supporting software and hardware of AI camera, Dongsheng Intelligent Technology can quickly and accurately detect tiny damages online, such as black chips, hidden cracks and perforations after the adjustment and optimization of algorithms. The early removal of these silicon chips is important to improve the quality of subsequent process and reduce the waste of subsequent process.
Defect types:
Black chips, hidden cracks, incomplete solder, black edge, black spots, cracked chips, etc.
Original picture Detection picture
Standardized software and hardware products + customized development Overall intelligent detection and a 35% cost reduction
US | 2080 N. Hwy 360,Grand
Prairie, Texas 75050
Business cooperation:sales@dstekai.com
Media cooperation:pr@dstekai.com
Talent recruitment:dshr@dstekai.com